Alumina · Service
Alumina Laser Drilling and Dicing
I need micro-vias or a diced pattern in ceramic substrate. Who lasers it without micro-cracking?
What it is
Removing ceramic with ultra-short-pulse CO2 or ultraviolet lasers that vaporise material faster than heat can conduct away, avoiding the thermal stress and micro-cracking a longer pulse would cause.
Suppliers
Suppliers 1
Companies that perform this process on customer material.
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Accumet Engineering, Inc. VerifiedAS9100
Laser cutting, drilling, welding, marking and ablation of ceramic substrates and other hard materials. Specific laser types and minimum hole diameters are not published.
source
Input material
Forms this process takes in.